The 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2015) is organized by the the IEEE EDS Taipei Chapter and the IEEE Reliability/CPMT/ED Singapore Chapter. The Symposium is technically co-sponsored by the IEEE Electron Devices Society and IEEE Reliability Society.
IPFA 2015 is devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies.
The symposium will be held in Hsinchu Science Park, Hsinchu, Taiwan for the second time in IPFA series. The venue is next to the Science with only 10 minutes driving distance, and the Science park is the well known "Tainwa's Silicon Valley".
Attandees may enjoy the visit to the cultural town of Hsinchu downtown that was developed more than 200 years ago and plan your visit to the well developed science park with major IC manufacturing/design companies located.
IPFA 2015 will consist of one day tutorial, 3 days technical presentations with two Keynote Addresses and many Invited Talks given by renowned speakers. One day of tutorial will be part of the technical program of IPFA 2015. Vendor exhibits presenting state-of-art laboratory equipment and technologies are held in parallel with the technical sessions. On the behalf of IPFA 2015 committee, we are sincerely looking forward to your attendance.
June 29 One-day tutorial
June 30 First day of the conference
July 1 Second day of the conference
July 2 Third day of the conference
June 29- July 2 Exhibit (from worlwide vendors)
Important Dates :
Submission of Summary and Abstract: 28 February 2015
Notification of Paper Acceptance: 20 April 2015
Submission of Final Manuscript: 2 June 2015